کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1501862 | 993397 | 2009 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Growth mechanism of a small surface crack of ultrafine-grained copper in a high-cycle fatigue regime
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
High-cycle fatigue tests were carried out on specimens of ultrafine-grained copper produced by equal channel angular pressing. The growth behavior of a small surface crack was monitored. A major crack, which led to the final fracture of the specimen, initiated from shear bands. After initiation, the crack grew linearly in the shear direction of the final pressing. A decrease in growth rate with a change in growth path morphology occurred when the crack length reached l ∼ 0.1 mm. This decrease occurred because of a change in the crack growth mechanism and is explained by considering the interrelation between grain size and the reversible plastic zone size at the crack tip.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 60, Issue 8, April 2009, Pages 729–732
Journal: Scripta Materialia - Volume 60, Issue 8, April 2009, Pages 729–732
نویسندگان
M. Goto, S.Z. Han, S.S. Kim, Y. Ando, N. Kawagoishi,