کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1502596 993426 2008 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation
چکیده انگلیسی

Thermal annealing of a nanostructured Cu sample processed by means of dynamic plastic deformation (DPD) induces static recrystallization (SRX) accompanied by a drop in strength and enhanced ductility. An obvious increment in tensile uniform elongation appears when the volume fraction of SRX grains exceeds 80%. The strength–ductility combination of the annealed nanostructured samples is superior to that of strain-induced ultrafine-grained Cu, owing to the finer grains and the presence of nanoscale twin bundles generated from the DPD.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 59, Issue 4, August 2008, Pages 475–478
نویسندگان
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