کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1503396 | 993470 | 2007 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
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![عکس صفحه اول مقاله: Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect](/preview/png/1503396.png)
چکیده انگلیسی
Interfacial reactions in a eutectic Sn–Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 × 104 A cm−2 for 166 h, an abnormal “polarity effect” was found where the intermetallic compound layer at the cathode was about 2.3 μm thicker than that at the anode. Upon increasing the temperature to about 185 °C, Cu–Zn compounds were replaced by Cu–Sn compounds at the anode and by a mixture of Cu–Zn and Cu–Sn compounds at the cathode.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 57, Issue 6, September 2007, Pages 513–516
Journal: Scripta Materialia - Volume 57, Issue 6, September 2007, Pages 513–516
نویسندگان
X.F. Zhang, J.D. Guo, J.K. Shang,