کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1506255 993786 2008 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effects of Cu, N, and Li intercalation on the structural stability and electronic structure of cubic Cu3N
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Effects of Cu, N, and Li intercalation on the structural stability and electronic structure of cubic Cu3N
چکیده انگلیسی

Using the plane wave pseudopotential method within the generalized gradient approximation, we have investigated the effect of Cu, N, and Li intercalation on the structural stability and electronic structure of Cu3N. The structural parameters, formation energies, single-crystal elastic constants, and electronic structures of cubic Cu3N, Cu4N, Cu3N2, and LiCu3N are predicted. The calculated lattice constant and bulk modulus of Cu3N are in excellent agreement with the available experimental values and previous theoretical results. Our results show that Cu, N, and Li intercalations into cubic Cu3N all induce a semiconductor-to-metal transition. Both Cu4N and LiCu3N can be stabilized thermodynamically and mechanically in cubic structure, but cubic Cu3N2 could not be mechanically stable.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Solid State Sciences - Volume 10, Issue 11, November 2008, Pages 1651–1657
نویسندگان
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