Current redistribution by intermetallic compounds in Through-Silicon-Via (TSV)

► The intermetallic compound, Al2Cu, has similar resistivity with Ni. ► The growth of the intermetallic compound, Al2Cu, detours the current paths and reduces the current crowding. ► A mathematic model successfully predicts the occurrence of early failure in the samples, based on the methodology. ► Simulation results proved the experimental phenomena and the mathematic analyses.