New packages for disc type power diodes

The paper presents a press-pack package integrated with a microchannel cooling system, which is a new thermal solution for power devices, e.g. diodes. In comparison with conventional solutions enforcing the use of either an air cooling system or a liquid one, the novel package is characterised by considerably smaller dimensions, lower weight and significantly higher thermal performance. The conducted measurements of the manufactured model showed that a thermal resistance of 0.0182 K/W can be obtained for an allowable pressure drop for electronic applications.