Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Polymethyl methacrylate (PMMA) composites filled with Aluminum Nitride (AlN) were prepared by powder processing technique. The microstructures of the composites were investigated by scanning electron microscopy techniques. The effect of AlN filler content (0.1–0.7 volume fraction (vf)) on the thermal conductivity, relative permittivity, and dielectric loss were investigated. As the vf of AlN filler increased, the thermal conductivity of the specimens increased. The thermal conductivity and relative permittivity of AlN/PMMA composites with 0.7 vf AlN filler were improved to 1.87 W/(m K) and 4.4 (at 1 MHz), respectively. The experimental thermal conductivity and relative permittivity were compared with that from simulation model.

► The highest thermal conductivity of the 0.7vf-AlN/PMMA can reach 1.87 W/(mK).
► The dielectric constant and loss are 4.4 and 0.017 respectively at 1 MHz.
► The measurement results are in good agreement with the simulation model.
► The relative permittivities of the samples at microwave frequency are less changed.
► The new polymer composite is a potential technique for microelectronics packaging.