کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1530452 | 995799 | 2009 | 7 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages](/preview/png/1530452.png)
The effect of nano Ni additions in Sn–9Zn and Sn–8Zn–3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn–Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn–9Zn and Sn–8Zn–3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.
Journal: Materials Science and Engineering: B - Volume 162, Issue 2, 25 May 2009, Pages 92–98