Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.