Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint

Highlights
- The Cu consumption mechanism is investigated by employing first principles.
- The effects of electric field and Sn grain orientation are considered.
- The Cu diffusion energies along a and c-axis of Sn grain are 0.83 and 0.17 eV.
- The Cu diffusion energies decreased with the increase of electric field.