Influence of impact angle on the interaction between Co55 nanocluster and Cu (0 0 1) substrate: Ionized cluster beam deposition

Using a classical molecular dynamics method, the influence of impact angle was studied on the ionized cluster beam (ICB) deposition. A many-body tight binding potential was employed to simulate the interactions among the atoms, in which the Co55 (55 atoms/cluster) nanocluster with the total energy of 110 eV was deposited on a Cu (0 0 1) substrate, whose temperature was set at 300 k. The quantitative of kinetic energy of the cluster, maximum temperature substrate, cluster center of mass and diffusion area of the cluster were proposed to evaluate the interacting mechanism nanocluster and substrate. Also, the influence of impact angle was investigated on the Co–Co and Cu–Co radial distribution function and the adhesion between cluster and substrate. The simulation data demonstrated the decrease of the maximum temperature substrate with the increase of impact angle. The results indicated the decrease in the maximum depth penetration with the increase in the impact angle. The thin film formed by Co55 nanocluster with the impact angle of 30° had the minimum adhesion with the substrate.

► The influence of impact angle on ICB deposition was studied by MD simulation.
► Time evolution of the kinetic energy of the cluster can be divided to three time stages.
► Higher diffusion area of the deposited can be achieved by increasing the impact angle.