Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

► Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. ► The maximum bonding strength occurs at 3 wt.% Ti addition. ► The Ti reacts with anodized Al oxide to form Al3Ti-rich and Al3Ti at joint interface.