Microstructural study of transient liquid phase bonded DD98 and K465 superalloys at high temperature

► DD98 and K465 alloy was TLP bonded. ► The microstructure changes of different parts were studied. ► CrB, M23B6 and MC formed in the bonding zone. ► M6C appeared in diffusion zone of K465 side and M3B2 existed in diffusion zone of DD98 side.