Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

► Mo nanoparticles do not dissolve or react with the SAC solder during reflow. ► Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. ► Mo nanoparticles influence the interfacial IMC through discrete particle effect.