کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1572039 | 1000666 | 2009 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructural developments in TLP bonds using thin interlayers based on Ni-B coatings
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
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چکیده انگلیسی
Oxide dispersion strengthened alloy MA 758 was transient liquid phase (TLP) bonded using thin interlayers based on Ni-B electrodeposited coatings and the microstructural developments across the joint region were studied. The bonding surfaces were electrodeposited with a coat thickness of 2-9 μm and microstructural features were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. The homogeneity of the joint was assessed performing micro-hardness test. The results showed that the coating thickness as well as the amount of melting point depressants (boron) in the coatings had a significant effect on the microstructural developments within the joint region. TLP bonds made using a 2 μm thick coating interlayer produced a joint with no visible precipitate formation and parent metal dissolution, and the absence of precipitates was attributed to the lower volume concentration of boron in the 2 μm thick coating interlayer.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Characterization - Volume 60, Issue 9, September 2009, Pages 1001-1007
Journal: Materials Characterization - Volume 60, Issue 9, September 2009, Pages 1001-1007
نویسندگان
R.K. Saha, T.I. Khan,