کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1572295 | 1000677 | 2008 | 5 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Microscopic bonding mechanism of welding interface with molten Cu–4Zn deposited on solid-state steel Microscopic bonding mechanism of welding interface with molten Cu–4Zn deposited on solid-state steel](/preview/png/1572295.png)
An initial characterization was carried out on the heat affected zone between a 30CrMnSi steel and a Cu–4Zn (wt.%) alloy formed from a novel welding technique involving induction melting of a Cu alloy over a steel substrate at 1100 °C. A very thin (∼ 20 nm) reaction interface between the steel substrate and the Cu alloy is shown to play a key role in effecting these joints. This reaction interface is an Fe–Cu rich discrete phase with a FCC structure and substantial coherence to both the steel substrate and the Cu alloy layer. This reaction interface is expected to form under highly non-equilibrium conditions and provides a bridging effect for the join. This is proposed as the major reason for the strength and mechanical integrity of the weld.
Journal: Materials Characterization - Volume 59, Issue 5, May 2008, Pages 542–546