کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1573016 | 1514668 | 2016 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Cu matrix composites reinforced with aligned carbon nanotubes: Mechanical, electrical and thermal properties
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Cu matrix composites reinforced with aligned carbon nanotubes: Mechanical, electrical and thermal properties Cu matrix composites reinforced with aligned carbon nanotubes: Mechanical, electrical and thermal properties](/preview/png/1573016.png)
چکیده انگلیسی
There are four technical difficulties in preparing carbon nanotubes/Cu composites: interface between carbon nanotubes/Cu, dispersion of carbon nanotubes (CNTs), densification of composites, and orientation of CNTs. Thus, Ni-Cu bilayers on Single-walled nanotubes (SWCNTs) was prepared through electroless plating to build up strong interaction between CNTs and Cu matrix. Powders were mixed through ultrasonic-assisted mechanical agitating to disperse SWCNTs homogeneously in Cu matrix. We employed hot forging to densify composite samples and Die-stretching to align SWCNTs. SWCNTs uniformly dispersed in the dense composites and aligned along stretch direction. The hardness and tensile strength increased 67.3% and 30.4% via the addition of 5Â vol% SWCNTs, respectively. The 5Â vol% SWCNTs/Cu composite were anisotropic in strength and conductivity. The mechanisms underlying the improved mechanical and conductive behavior were evaluated, and this research provides novel ideas and technology for the distribution and directional alignment of CNTs in the matrix.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 675, 15 October 2016, Pages 82-91
Journal: Materials Science and Engineering: A - Volume 675, 15 October 2016, Pages 82-91
نویسندگان
Shan Zhao, Zhong Zheng, Zixin Huang, Shijie Dong, Ping Luo, Zhuang Zhang, Yaowei Wang,