کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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1573638 | 1514685 | 2016 | 5 صفحه PDF | دانلود رایگان |
Nano-sized bubble dispersion in copper was achieved by a powder metallurgy method based on ball milling and spark plasma sintering. The microstructure of bubbles was evaluated by using Transmission Electron Microscopy (TEM), and the bubble size and interspacing were further quantitatively determined from small-angle X-ray scattering (SAXS) measurement. From TEM observation, the average radius of bubbles is 2 nm and their interspacing is 75 nm, while according to SAXS measurement, the radius is found to be 1.5 nm and the interspacing is 54 nm. By combining those parameters with the bubble distribution and Vickers hardness, the obstacle strength factor was evaluated as 0.23 by using TEM result, and 0.16 by using SAXS data. This suggested that bubbles could impede dislocation motion.
Journal: Materials Science and Engineering: A - Volume 658, 21 March 2016, Pages 296–300