کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1575576 | 1514750 | 2014 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging](/preview/png/1575576.png)
چکیده انگلیسی
In this paper, pure Cu sheet with thickness of 1Â mm was electromagnetically budged to form a conical shape workpiece. The deformation behavior and the microstructural evolution of the Cu sheet under electromagnetic bulging were systematically studied using strain analysis, optical microscopy (OM), electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM). It is found that the strain distribution in the workpiece is quite un-uniform from the bottom to the top due to the inhomogeneous electromagnetic pressure generated by the spiral coil. The characterization of microstructure reveals that the bulge deformation of the Cu sheet is governed by dislocation multiple slip and cross slip, which cause finally the formation of cell structures. However, the size and the boundary width of cells are closely related to the plastic strain, i.e., the cell size and boundary width decrease with increasing strain. In addition, low misorientation angle of cells inside the grains increases with increasing strain. This structural evolution is discussed on the basis of the low energy dislocation structures (LEDS) theory.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 593, 21 January 2014, Pages 127-135
Journal: Materials Science and Engineering: A - Volume 593, 21 January 2014, Pages 127-135
نویسندگان
H.W. Jiang, N. Li, Y.Y. Xiong, Z.G. Li, L. Liu,