Effect of aluminum on microstructure and property of Cu–Ni–Si alloys

The effect of aluminum on the microstructure and properties of Cu–Ni–Si alloys has been investigated using hardness test, electrical conductivity measurement, optical microscopy, X-ray diffraction analysis, scanning electron microscopy and transmission electron microscopy. Compared with Cu–Ni–Si alloy, Cu–Ni–Si–Al alloy had finer grains. After homogenization treatment at 940 °C for 4 h, hot rolling by 80% at 850 °C, solution treatment at 970 °C for 4 h, cold rolling by 50% and ageing treatment at 450 °C for 60 min, properties better than Cu–Ni–Si alloy have been obtained in Cu–Ni–Si–Al alloy: hardness was 343 HV, electrical conductivity was 28.1% IACS, tensile strength was 1080 MPa, yield strength was 985 MPa, elongation percentage was 3.1% and stress relaxation rate was 9.83% (as tested at 150 °C and loading for 100 h). β-Ni3Si and δ-Ni2Si formed during the ageing process and the crystal orientation relationship between matrix and precipitates was : (02̄2̄)Cu(01̄1̄)β(010)δ, [100]Cu[100]β[001]δ; (111̄)Cu(111̄)β(02̄1)δ, [112112]Cu[112112]β[012]δ. Addition of Al promoted the precipitation, and effectively enhanced the anti-stress relaxation property. Quasi-cleavage fracture with shallow dimples appeared in designed Cu–Ni–Si–(Al) alloy.