Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler

The fracture of Ti/Ti joints was found to mainly propagate along the grain boundary. In the MAO-TiO2/MAO-TiO2 and MAO-TiO2/Ti samples, the failure mode transitioned from MAO-TiO2 layer/Ti interfacial fracture to fracture within the active solder.