کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1579313 | 1514827 | 2010 | 4 صفحه PDF | دانلود رایگان |
SiCW/SiC composites without an intergranular glassy phase are prepared by the CVI process. The microstructure and high temperature strength of SiCW/SiC composites are investigated. The high temperature strength of SiCW/SiC composites depends on the interfacial bonding strength between matrix and whiskers. The matrix is effectively strengthened and toughened by the whiskers, and SiCW/SiC composites show a constant strength of 475 ± 32 MPa below 1000 °C. The flexural strength gradually declines from 475 ± 32 MPa to 208 ± 15 MPa at the temperature from 1000 °C to 1500 °C due to the decreased whisker-matrix interfacial bonding strength. The interfacial bonding strength is too low to transfer stress from the matrix to the whiskers, and SiCW/SiC composites show a constant strength of 208 ± 15 MPa at temperatures from 1500 °C to 1800 °C. The fracture mode of SiCW/SiC composites changes from the toughened fracture below 1000 °C to the brittle fracture above 1000 °C.
Journal: Materials Science and Engineering: A - Volume 527, Issues 21–22, 20 August 2010, Pages 5592–5595