کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1579592 | 1001228 | 2010 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
The microstructural basis for the mechanical properties and electrical resistivity of nanocrystalline Cu-Al2O3
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The mechanical properties and electrical resistivity of nanocrystalline copper reinforced by 1Â vol.% and 5Â vol.% of nano-alumina particles have been measured. The composites were prepared by ball-milling and consolidated by a combination of hot extrusion and HIPing. The uniaxial tensile and compressive strengths are comparable for each composite, and an elastic, ideally plastic response is observed. Shear bands, of width a few microns, accompany plastic deformation. A number of microstructural characterisation tools were used to reveal that grain boundary strengthening and dispersion strengthening are the dominant strengthening mechanisms. Nano-indentation measurements reveal a size effect in hardness. The electrical resistivity is almost double that of pure oxygen free copper and this is mainly ascribed to the presence of dissolved iron.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 527, Issue 20, 25 July 2010, Pages 5065-5071
Journal: Materials Science and Engineering: A - Volume 527, Issue 20, 25 July 2010, Pages 5065-5071
نویسندگان
S. Nachum, N.A. Fleck, M.F. Ashby, A. Colella, P. Matteazzi,