کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1579959 | 1001234 | 2010 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Thermal and dynamic mechanical characterization of thermoplastic polyurethane/organoclay nanocomposites prepared by melt compounding
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
Thermoplastic polyurethane (TPU) nanocomposites based on organically modified layered silicate (OMLS) were prepared by melt intercalation process followed by compression molding. Different percentage of organoclays was incorporated into the TPU matrix in order to examine the influence of the nanoscaled fillers on nanostructure morphology and material properties. The microscopic morphology of the nanocomposites was evaluated by wide angle X-ray diffraction (WAXD), transmission electron microscopy (TEM), and atomic force microscopy (AFM). The observation revealed that both nanoclay-polymer interactions and shear stress developed during melt mixing are responsible for the effectively organoclay dispersion in TPU matrix resulting intercalated/exfoliated morphology. Thermal stability of the nanocomposites measured by thermogravimetric analysis (TGA) was improved significantly with the addition of nanoclay. The differential scanning calorimetry (DSC) analysis reveals that melting point of the nanocomposites increased with incorporation of nanoclay. The dynamic mechanical properties of the TPU nanocomposites were analyzed using a dynamic mechanical thermal analyzer (DMTA), which indicates that the storage modulus (Eâ²), loss modulus (Eâ³), and glass transition temperature (Tg) are significantly increased with increasing nanoclay content.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 527, Issue 3, 15 January 2010, Pages 812-823
Journal: Materials Science and Engineering: A - Volume 527, Issue 3, 15 January 2010, Pages 812-823
نویسندگان
A.K. Barick, D.K. Tripathy,