کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1583006 | 1514882 | 2008 | 6 صفحه PDF | دانلود رایگان |

Electron backscattered Kikuchi patterns (EBSP) and optical microscopy (OM) have been employed to reveal grain growth and texture evolution in electroformed copper liners of shaped charges with ultrafine grains and a strong 〈1 1 0〉 fiber texture, which were annealed at various temperatures. By annealing below 410 °C, the grains grow uniformly and show a normal growth. By annealing at 530 °C, a different growth mode has been observed. The grains grow non-uniformly by the growth of a few grains and numerous annealing twins were observed in the samples. Up to 650 °C annealing, extensive abnormal grain growth appears in the sample. EBSP analysis shows that the 〈1 1 0〉 fiber texture, which exists originally in the as-electroformed copper sample, was weakened and tended to disappear during grain growth with increasing annealing temperature over 410 °C. Meanwhile, the changes of grain boundary misorientations in specimens subjected to higher annealing temperature (530 °C and 650 °C) suggest that a progressive weakening of the 〈1 1 0〉 fiber texture results in decreasing in the fraction of low-angle boundaries. Possible recrystallization mechanism in electroformed copper liners of shaped charges is discussed.
Journal: Materials Science and Engineering: A - Volume 474, Issues 1–2, 15 February 2008, Pages 208–213