A Study on surface property of thick-film embedded resistor fabricated by laser micro-cladding and rapid prototype

With the rapid-speed development of high-integrated level, it is a trend that resistor components are embedded in thick-film circuit. The size of resistor components fabricated by conventional thick-film technology had gradually reduced to a limited value because of its shortcomings. The technology of laser micro-cladding and rapid prototype has many advantages, such as rapid speed, high energy, minor spot diameter, high focused performance and high degree of accuracy. It may obtain resistor components and circuit of high degree of high property and quality. However, to multi-layer materials, the surface property of every layer will have an important effect on the integrated density of package or IC because they have uneven distribution of materials thickness along the integrated direction. The interaction between laser and materials differs from sintering. The surface property obtained by laser scanning had been studied in this paper, results shown as following: the surface of resistors fabricated by this technology was smooth and without any defect, but that of resistors fabricated by sintering was uneven and with a lot of pores.