کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1584714 | 1514904 | 2007 | 9 صفحه PDF | دانلود رایگان |
This study investigates composite lead-free solders fabricated by adding between 0.5 and 3 wt% of Ni particles in situ to Sn–3.5 wt%Ag lead-free solder. The single lap shear strength, fracture behavior and microstructural evolution characteristics of the as-reflowed specimens are examined and compared with those of specimens thermally aged at 150 °C for various aging times. In general, it is found that the single lap shear strength of the joints increases with increasing Ni addition in the as-reflowed condition, but decreases with increasing storage time in the aged specimens. For Ni additions of 0.5 and 1 wt%, the specimens fracture in the solder near the intermetallic compound (IMC) layer/solder interface, which suggests that the solder matrix has a lower strength than the IMC layer. The presence of elongated dimple-like structures on the fracture surfaces of these specimens is indicative of a ductile failure mode. For Ni additions of more than 1 wt%, the specimens fracture with brittle characteristics at the solder/IMC interface, which indicates that an increased Ni addition increases the strength of the solder matrix beyond that of the interfacial layer.
Journal: Materials Science and Engineering: A - Volume 444, Issues 1–2, 25 January 2007, Pages 75–83