کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1585275 | 1514913 | 2006 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructure evolution in a Pb-free solder alloy during mechanical fatigue
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Microstructure evolution in a Pb-free solder alloy during mechanical fatigue Microstructure evolution in a Pb-free solder alloy during mechanical fatigue](/preview/png/1585275.png)
چکیده انگلیسی
Microstructural evolution in a Sn-rich eutectic Sn-3.8Ag-0.7Cu solder alloy has been investigated in low cycle mechanical fatigue. Inhomogeneity in deformation occurred on a grain scale (determined by grain orientation and plastic anisotropy of Sn) and on a subgrain scale where persistent slip bands were observed in Sn dendrites. Microcracks are formed predominantly on interfaces between the persistent slip bands and the eutectic regions within grains. Grain boundary decohesion or sliding was not observed, which is in sharp contrast to recent findings in unconstrained thermal fatigue of Sn-3.8Ag-0.7Cu.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 431, Issues 1â2, 15 September 2006, Pages 166-174
Journal: Materials Science and Engineering: A - Volume 431, Issues 1â2, 15 September 2006, Pages 166-174
نویسندگان
M.A. Matin, W.P. Vellinga, M.G.D. Geers,