کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1585619 1514918 2006 14 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
A new approach for evaluating thin film interface fracture toughness
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
A new approach for evaluating thin film interface fracture toughness
چکیده انگلیسی

A material configuration of central importance in microelectronics, optoelectronics, and thermal barrier coating technology is a thin film of one material deposited onto a substrate of a different material. Fabrication of such a structure inevitably gives rise to stress in the film due to lattice mismatch, differing coefficient of thermal expansion, chemical reactions, or other physical effects. Therefore, in general, the weakest link in this composite system often resides at the interface between the thin film and substrate. In order to make multi-layered electronic devices and structural composites with long-term reliability, the fracture behavior of the material interfaces must be known. This project is intended to address the problems associated with the deficiency of the existing methods, which show severe scatter in the existing data and the procedure dependence in thin film/coating evaluation methods, and offers an innovative testing procedure for the determination of interface fracture toughness applicable to thin coating materials in general.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 426, Issues 1–2, 25 June 2006, Pages 332–345
نویسندگان
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