کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1599973 | 1515861 | 2014 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Study of the intermetallic growth in copper-clad aluminum wires after thermal aging
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
Study of the solid-state diffusion between copper and aluminum was carried out in the temperature range [573-673] K in order to better understand the aging mechanisms which occur in copper-clad aluminum thin wires. A complete microscopic analysis was performed to evaluate the interface composition and corresponding microstructure. The intermetallic phases developed during annealing identified by TEM and X-Ray diffraction analysis are respectively Al2Cu, AlCu, and Al4Cu9. A fine layer containing nanometric copper grains was also depicted and identified as a diffusion-induced recrystallization region. These results agree with EDXS analysis and nanoindentation measurements. The effective heat of formation model was used to evaluate the first phase(s) which happens in the interface and the sequence formation of intermetallic compounds during annealing. This model finely describes the metallurgical aging of copper-clad aluminum wires and explains the presence of only three intermetallic compounds in the interface between copper and aluminum.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Intermetallics - Volume 50, July 2014, Pages 34-42
Journal: Intermetallics - Volume 50, July 2014, Pages 34-42
نویسندگان
Antoine Gueydan, Bernadette Domengès, Eric Hug,