The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads

► To prepare the nano metallic particles doped Sn-Ag-Cu composite solders. ► To investigate the morphology of IMC of composite solders and OSP-Cu pad. ► Kinetic analysis of IMC layers of composite solders and OSP-Cu pad. ► To measure the hardness of Sn-Ag-Cu-0.5Ni and Sn-Ag-Cu-0.5Al composite solders.