کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1636686 1516957 2015 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of temperature on interface diffusion in micro solder joint under current stressing
ترجمه فارسی عنوان
اثر دما بر روی انتقال رابط در اتصالات میکرو لحیم تحت تنش فعلی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
چکیده انگلیسی
The effects of temperature on Cu pad consumption and intermetallic compound (IMC) growth were investigated under current stressing. The Cu/Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints were used, with a certain current density of 0.76×104A/cm2 at 100, 140, 160 and 180 °C. The constitutive equations of cathode Cu pad consumption and anode interface IMC growth are established, respectively, based on the loading time and sample temperature. The cathode Cu pad consumption (δ) increases linearly with the loading time and the consumption rate shows parabolic curve relationships with sample temperature. The anode interface IMC thickness (δ1) increased is linearly with the square root of loading time and the interface IMC growth coefficient shows parabolic curve relationship with sample temperature. The δ and δ1 have different variation laws under current stressing, due to the current facilitating larger amount of IMC formation in the bulk solder.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Transactions of Nonferrous Metals Society of China - Volume 25, Issue 5, May 2015, Pages 1699-1703
نویسندگان
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