کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1637118 | 1516993 | 2012 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Chemical etching process of copper electrode for bioelectrical impedance technology
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Chemical etching process of copper electrode for bioelectrical impedance technology Chemical etching process of copper electrode for bioelectrical impedance technology](/preview/png/1637118.png)
چکیده انگلیسی
In order to obtain bioelectrical impedance electrodes with high stability, the chemical etching process was used to fabricate the copper electrode with a series of surface microstructures. By changing the etching processing parameters, some comparison experiments were performed to reveal the influence of etching time, etching temperature, etching liquid concentration, and sample sizes on the etching rate and surface microstructures of copper electrode. The result shows that the etching rate is decreased with increasing etching time, and is increased with increasing etching temperature. Moreover, it is found that the sample size has little influence on the etching rate. After choosing the reasonable etching liquid composition (formulation 3), the copper electrode with many surface microstructures can be obtained by chemical etching process at room temperature for 20 min. In addition, using the alternating current impedance test of electrode-electrode for 24 h, the copper electrode with a series of surface microstructures fabricated by the etching process presents a more stable impedance value compared with the electrocardiograph (ECG) electrode, resulting from the reliable surface contact of copper electrode-electrode.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Transactions of Nonferrous Metals Society of China - Volume 22, Issue 6, June 2012, Pages 1501-1506
Journal: Transactions of Nonferrous Metals Society of China - Volume 22, Issue 6, June 2012, Pages 1501-1506
نویسندگان
Wei ZHOU, Rong SONG, Le-lun JIANG, Wen-ping XU, Guo-kai LIANG, De-cai CHENG, Ling-jiao LIU,