Micro bulging of thin T2 copper sheet by electromagnetic forming

Electromagnetic micro bulging experiments on T2 copper were achieved in order to find the effects that different voltages and depths of mold work on deformation characters. Laser scanning confocal microscope and contourgraph were used to study the effects of electromagnetic forming parameters such as voltage and die depth on material. Results show that width and depth of micro channel increase with the increases of voltage with a certain die depth, moreover, forming depth reaches the maximum at 7 500 V. And then rebound emerges and forming depth decreases. Forming depth and width of channel increase with the decease of die depth at a certain voltage; and forming depth reaches maximum at 0.5 mm of die depth. Therefore, rebound is weakened and the traces caused by bad exhaust disappears gradually, and surface roughness decreases simultaneously in electromagnetic bulging experiments.