کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1639569 1517016 2011 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Reliability of flip-chip bonded RFID die using anisotropic conductive paste hybrid material
چکیده انگلیسی

A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Transactions of Nonferrous Metals Society of China - Volume 21, Supplement 1, March 2011, Pages s175-s181