Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications

TiB2p/Cu composites with high reinforcement content (ϕp=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB2p/Cu composites were investigated. The results show that TiB2 particles are homogeneous and distribute uniformly, and the TiB2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the TiB2p/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20–100 °C for TiB2p/Cu composites range from 8.3×10−6 to 10.8×10−6/K and decrease with increasing volume fraction of TiB2. The experimental coefficients of thermal expansion agree well with the predicted values based on Turner's model. The thermal conductivities of TiB2p/Cu composites range from 167.3 to 215.4 W/(m·K), decreasing with increasing volume fraction TiB2.