کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1679633 | 1010325 | 2006 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Ultra-thinning Processing of Dielectric Substrates by Precision Abrasive Machining
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Ultra-thinning Processing of Dielectric Substrates by Precision Abrasive Machining Ultra-thinning Processing of Dielectric Substrates by Precision Abrasive Machining](/preview/png/1679633.png)
چکیده انگلیسی
The ultra-thin dielectric substrate was obtained by precision grinding and lapping/polishing. In the precision grinding, the substrate was thinned until 50 μm in thickness using fine-grained diamond wheels and a polishing pad. The substrates in the lapping and polishing were thinned to 17 μm in thickness with good flatness. The good flatness was produced by hard polishing pad made of polyvinyl chloride resin owing to their mechanical properties of high fixed grain density. These were confirmed by detailed AFM observations. Finally, the substrates were segmentalized to produce five thousand small tips (2 mm × 0.4 mm) by a precision dicing device.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: CIRP Annals - Manufacturing Technology - Volume 55, Issue 1, 2006, Pages 317-320
Journal: CIRP Annals - Manufacturing Technology - Volume 55, Issue 1, 2006, Pages 317-320