Effect of voids-controlled vacancy supersaturations on B diffusion

We present here preliminary results on boron diffusion in presence of pre-formed voids of different characteristics. The voids were fabricated by helium implantation followed by annealing allowing the desorption of He prior to boron implantation. We show that under such conditions boron diffusion is always largely reduced and can even be suppressed in some cases. Boron diffusion suppression can be observed in samples not containing nanovoids in the boron-rich region. It is suggested that direct trapping of Si(int)s by the voids is not the mechanism responsible for the reduction of boron diffusion in such layers. Alternatively, our experimental results suggest that this reduction of diffusivity is more probably due to the competition between two Ostwald ripening phenomena taking place at the same time: in the boron-rich region, the competitive growth of extrinsic defects at the origin of TED and, in the void region, the Ostwald ripening of the voids which involves large supersaturations of Vs.