Cooling rate limitations in the diffusion bonding of microchannel arrays

A significant barrier to the diffusion bonding of microchannel arrays is the large capital investment required to setup production. This large capital investment extends from long heating and cooling cycles leading to poor production capacities. Empirical studies in industry have shown that cooling rate is limited by the warpage of microchannel laminae, which is believed to be caused by thermal buckling. In this paper, the limits of cooling rates based on thermal buckling during the diffusion bonding of microchannel laminae are investigated. Finite element analyses of the transient thermal and stress behaviors of these microchannel laminae were conducted to identify the maximum cooling rates for different lamina thicknesses. Findings confirm that cooling rates are limited by the thermal buckling of unconstrained microchannel laminae during cooling of the device. Finite element analysis results are used to extrapolate implications for microchannel production.