Study of droplet deformation, heat-conduction and solidification using incompressible smoothed particle hydrodynamics method

This paper presents a numerical model based on incompressible smoothed particle hydrodynamics (SPH) method to simulate the deformation, heat-conduction and solidification process of a droplet impinging on a substrate. Continuum, momentum and energy equations of the fluid flow are solved using SPH method, with van der Waals force accounting for the surface tension and Fourier's law for heat conduction. Incompressible smoothed particle hydrodynamics method (ISPH) is used here instead of weakly compressible smoothed particle hydrodynamics method (WSPH), to satisfy the fluid incompressibility. Effects of rough and smooth substrates are also taken into account. Results show that the droplet begins to deform and spread, followed by solidification. Also, the temperature of droplet falls faster in the rough one, and this may attribute to the roughness.