کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1788908 1023483 2010 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
The influence of moisture on atmospheric pressure plasma etching of PA6 films
موضوعات مرتبط
مهندسی و علوم پایه فیزیک و نجوم فیزیک ماده چگال
پیش نمایش صفحه اول مقاله
The influence of moisture on atmospheric pressure plasma etching of PA6 films
چکیده انگلیسی

The moisture in the substrate material may have a potential influence on atmospheric pressure plasma treatment. In order to investigate how the existence of moisture affects atmospheric pressure plasma treatment, polyamide 6 (PA6) films were treated by helium, helium/oxygen (O2) plasmas using atmospheric pressure plasma jet (APPJ) at different moisture regain. The film surfaces were investigated using contact-angle measurements, atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) to characterize the surfaces. The exposure of PA6 film surfaces to the plasmas led to the etching process on the surfaces and changes in the topography of the surfaces. It was shown that the etching rate and the surface roughness were higher for the 9.33% moisture regain (relative humidity 100%) group than that of the 1.61% moisture regain (relative humidity 10%) group with the same plasma gas and power.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Current Applied Physics - Volume 10, Issue 1, January 2010, Pages 230–234
نویسندگان
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