High density copper nanowire arrays deposition inside ordered titania pores by electrodeposition

Large area and free-standing TiO2 films was prepared by ultrasonic splitting and a chemical etching step was used to open the closed bottom end of TiO2 films and yields a high aspect-ratio anodic titanium oxide membrane open at both ends. Ordered Cu nanowire structures were fabricated by a simple electroplating method inside high aspect-ratio anodic titanium oxide membrane. Scanning electron microscopy (SEM), transmission electron microscopy (TEM), and the X-ray diffraction (XRD) were employed to characterize the resulting samples. Detailed results and the possible mechanism are presented.