3D detector and electronics integration technologies: Applications to ILC, SLHC, and beyond

The application of vertically integrated (3D) electronics to particle physics has been explored by the our group for the past several years. We have successfully designed the first vertically integrated demonstrator chip for ILC vertex detection in the three-tier MIT-Lincoln Labs process. We have also studied sensor integration with electronics through oxide bonding and silicon-on-insulator technology. This paper will discuss the status of these studies and prospects for future work.