کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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217627 | 1426417 | 2008 | 5 صفحه PDF | دانلود رایگان |
Because of increasing interest in environmentally benign fabrication process, the use of dry cleaning processes to remove residues of metal, photoresists, organic moieties and particles from surfaces has grown as a research area. In this study, we designed series of systematic approaches to understand the properties of the hard-baked photoresist on glass substrates. We focused on the effects of de-bonding photoresists on the surface by using a plasma-assisted supercritical carbon dioxide removal process with various control parameters. Changes in the surface morphology of plasma de-bonded photoresists were observed and analyzed. A weight-loss method was used to evaluate quantitatively the efficiency of photoresist stripping by SCCO2. Compared to the blank experiment (SCCO2 process only), the photoresist residue reduces to 14.7% from 76.3%. This study demonstrates the possibility of incorporating plasma pretreatment into the supercritical carbon dioxide removal process for photoresist stripping applications.
Journal: Journal of the Chinese Institute of Chemical Engineers - Volume 39, Issue 3, May 2008, Pages 243–247