Advances in Silicon Resonant Pressure Transducers

This paper presents a MEMS Resonant Pressure Transducers (RPT) that is produced using a flexible fabrication route to allow pressure ranges from 1bar to 700bar in fully oil isolated hermetic packages without compromising sensor performance. The fabrication method makes use of silicon fusion bonding (SFB) and deep reactive ion etching (DRIE) to build up a three-layer die, with the middle layer consisting of a strain sensitive resonator. The key aspects of the fabrication process and sensor design that make this possible are presented, along with data showing long-term stability of better than 100ppm drift per year.