Enhancement of the thermal conductivity of adhesives for wood flooring using xGnP

Using exfoliated graphite nanoplatelets (xGnP), resin/xGnP composites were prepared by stirring xGnP in the epoxy resin with hardener and polyurethane(PU) resin to increase the thermal conductivity of an under-floor heating system using wood flooring. xGnP of 1, 2 and 3 wt% was added to pure epoxy and PU resin at room temperature. The thermal conductivity of resin/xGnP composites was increased with the increased with the increase of xGnP loading contents. Also, the increased bonding strength of epoxy/xGnP composite was manifested in the results of a single lap shearing test. Harden resin/xGnP composites showed endothermic energy curves according to thermal conductivity by differential scanning calorimeter (DSC) measurement. Resin/xGnP composites showed higher thermal conductivity than pure resins and absorbed less energy than pure resins with increasing temperature. Applying xGnP to the installation resin of wood flooring cannot only be effective in increasing the thermal conductivity of installation resin but is also inexpensive, has easy dispersion and good mechanical properties.

► We study to increase the thermal conductivity of resin for installing a flooring.
► xGnP increases the thermal conductivity of epoxy and urethane composites.
► DSC can estimate the thermal conductivity of same materials with content of fillers.
► Thermal conductivity of flooring is important for energy consumption by On-dol.