On the physical robustness of RF on-chip nanostructured security

The main objective of this paper is to investigate the physical robustness of a newly-proposed RF-based fingerprinting and security technique. This technique aims at securing electronic chips utilizing the fabrication technology as well as chip packaging. It is based on using micro- and nanostructured composite materials mixed with a dielectric fixing matrix. Several experimental investigations on the repeatability, temperature-robustness and response to physical attacks on different mixtures and particle sizes are herewith discussed.