Towards realisation of mixed carbon nanotube bundles as VLSI interconnects: A review

Carbon nanotube based interconnect technology is becoming popular for its various merits over the current copper technology. The ability to conduct high current at high temperatures through the 1D structure is making the CNT interconnect technology an attractive one. Single wall and multi wall CNT interconnects have received greater interest initially when the mixed CNT bundles (MCBs) did not get much attention as VLSI interconnects. But, it was only in 2007 when the conductance study of mixed CNT bundles was done and since then many works have been reported. At this stage, it is essential to review the reports of MCB based interconnect technology. We present in this paper, the first review on MCB VLSI interconnects.