کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
4971606 1450524 2017 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Study of GHz-SAM sensitivity to delamination in BEOL layers
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Study of GHz-SAM sensitivity to delamination in BEOL layers
چکیده انگلیسی
Two different back-end-of-line (BEOL) stacks were indented using Berkovich and wedge tips with different indentation forces to simulate failure modes such as cracks and delamination. The indentation areas were investigated by acoustic GHz-microscopy for the detection of these defects. For validation, results were correlated to the SEM images of FIB-prepared cross-sections through the indented areas and their topologies were measured. The acoustic GHz-microscope proves to be a promising tool for the visualization of crack- and delamination defects on a scale of below 10 μm and shows a great potential for BEOL mechanical strength analysis.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volumes 76–77, September 2017, Pages 238-242
نویسندگان
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