کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
4971636 | 1450524 | 2017 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Young's modulus of a sintered Cu joint and its influence on thermal stress
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
Al2O3 chips and pure Cu plates were joined by Cu nanoparticles at 250 °C and 350 °C, and the Young's moduli of the sintered Cu were evaluated by nanoindentation tests. The average Young's moduli were 52.7 ± 19.8 GPa and 76.5 ± 29.7 GPa at 250 °C and 350 °C, respectively, indicating that the sintered structures were strengthened at higher temperatures. The calculation results indicated that the joint at 350 °C has a high Young's modulus, but make the stress higher than the chip strength, resulting in breakage of the chip during 65/250 °C power cycling.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volumes 76â77, September 2017, Pages 405-408
Journal: Microelectronics Reliability - Volumes 76â77, September 2017, Pages 405-408
نویسندگان
T. Ishizaki, D. Miura, A. Kuno, K. Hasegawa, M. Usui, Y. Yamada,